• 1. Chip Bonding

  • 2. Offset Printing

  • 3. Compound

  • 4. Die-Cutting

  • 5. Data Processing

  • 6. QC & Packing

  • 1. Semi-finished-Produce

  • 2. CMYK-Offset-Printing

  • 3. Silkscreen-Printing

  • 4. Lamination

  • 5. Punching

  • 6. Number-Printing

  • 7. QC

  • 8. Package

  • 1. COB-Bonding

  • 2. Testing

  • 3. Frictioning

  • 4. Drop-Glue

  • 5. Polish

  • 6. Packing